Baodao Innovation Logo
NVIDIA H200 SXM

NVIDIA H200 SXM

H200 chip with self-manufactured module, paired with a H3C head unit; performance equivalent to branded all-in-one systems.

Product Specifications

Parameter Item

Parameter Value

GPU Architecture

NVIDIA Hopper

Manufacturing Process

TSMC 4N

Transistor count

800 billion

FP64

34 TFLOPS

FP64 Tensor Core

67 TFLOPS

FP32

67 TFLOPS

TF32 Tensor Core (with sparsity)

989 TFLOPS

BFLOAT16 Tensor Core (with Sparsity)

1,979 TFLOPS

FP16 Tensor Core (with sparsity)

1,979 TFLOPS

FP8 Tensor Core (with Sparsity)

3,958 TFLOPS

INT8 Tensor Core (with sparsity)

3,958 TOPS

GPU VRAM

141 GB HBM3e

VRAM bandwidth

4.8 TB/s

NVLink Interconnect

4-generation NVLink, 900 GB/s

PCIe

PCIe Gen5, 128 GB/s

Tensor Core

4th Generation

Transformer Engine

2th Generation

Maximum Power Dissipation (TDP)

Up to 700W

Multi-Instance GPU (MIG)

Up to 7 instances, each with 8GB

Dimensions

SXM

Video Decoder

7 NVDEC / 7 JPEG

Confidential Computing

Support

Typical Applications

High-throughput inference for large language models, HPC memory-intensive applications, and LLM service deployment

Professional Quality Guaranteed
Global Logistics & Distribution
Professional Technical Support

Pricing Details

Product price is negotiable and determined by order quantity, configuration requirements, and delivery terms.

Submit an inquiry using the form below. Our expert team will provide a detailed quote within 24 hours.

Get a Quote

Product Details

Can't find the right product?

Contact our expert team for customized solutions tailored to your specific needs.

Contact Us
苏ICP备2024116030号-2