Power Control and Micro-Assembly Components
ProfessionalPower Control and Micro-Assembly ComponentsSupplier delivering high-quality products and solutions
Power Divider Chip
GaAs Power Divider, 1-way to 2, operating frequency 2~18 GHz
Power combiner chip
GaAs Power Combiner, 2 into 1, Operating Frequency 6~18 GHz
Microassembly Interconnect Substrate
High-Density Micro-Assembly Interconnect Substrate, Multi-Layer Structure
Low-Temperature Co-fired Ceramic (LTCC) Substrate
LTCC Ceramic Substrates for High-Frequency Applications
Thin-film circuit substrate
Thin-film circuit substrates, high-precision patterning
Inverted bump fabrication
Wafer-Level Flip-Chip Bumping Services
Gold wire bonding interconnect
Gold wire bonding interconnect technology, high reliability
Strip welding interconnect
Strip welding interconnects for high-current applications
Conductive adhesive bonding
Conductive adhesive bonding process, low-temperature curing
Eutectic Soldering
Eutectic Soldering Process for High Thermal Conductivity Applications
Airtight Enclosure
Metal hermetically sealed enclosure, corrosion-resistant
Ceramic Package Enclosure
Alumina ceramic package housing with excellent high-frequency performance
Molding compound encapsulation
Epoxy molding process, low-cost
Potting compound filling
Polyurethane potting compound filling for shock and water resistance
Heat Sink Substrate
High Thermal Conductivity Substrate for Power Devices
Electromagnetic Shielding Can
Metal electromagnetic shielding enclosure, suppresses interference
Radar-absorbing material patch
Flexible microwave-absorbing patch to reduce reflection
Thermal Interface Material
High-performance thermal interface material for reduced thermal resistance